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US 11,776,890 B2Granted
Power semiconductor device
AssigneeSamsung SDI Co., Ltd.
InventorsFlorian Maxl, Markus Pretschuh, Maximilian Hofer, Peter Kurcik
Life of this patent
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Abstract
A power semiconductor device includes: a power semiconductor; a base metal sheet; and a flexible printed circuit board (PCB) between the base metal sheet and the power semiconductor. The power semiconductor includes a first power pad on a side facing the flexible PCB, and the flexible PCB includes a conductive pad, one side of which is electrically connected to the first power pad of the power semiconductor and the opposite side of which is electrically connected to the base metal sheet.
Claims13
A power semiconductor device for a vehicle, the power semiconductor device comprising:
- a plurality of power semiconductors arranged in a first subset of power semiconductors and a second subset of power semiconductors;
- a base metal sheet comprising a first base metal sheet and second base metal sheet, each of the first and second base metal sheets being electrically isolated from each other;
- a one-layer flexible printed circuit board (PCB) comprising one conductive layer and being between the base metal sheet and the power semiconductors;
- and
- a top metal sheet,
- wherein each of the power semiconductors comprises a first power pad on a side facing the flexible PCB,
- wherein the conductive layer of the flexible PCB comprises a plurality of conductive pads,
- wherein one side of a first one of the conductive pads is electrically connected to the first power pad of one of the power semiconductors in the first subset of power semiconductors and the opposite side of the first one of the conductive pads is electrically connected to the first base metal sheet,
- wherein one side of a second one of the conductive pads is electrically connected to the first power pad of one of the power semiconductors in the second subset of power semiconductors and the opposite side of the second one of the conductive pads is electrically connected to the second base metal sheet,
- wherein each of the power semiconductors comprises a second power pad on a side facing away from the flexible PCB, and
- wherein the top metal sheet is electrically connected to the second power pad of the power semiconductors.
8 more elements
Dependencies are inferred from the claim text.