Package with a substrate comprising protruding pad interconnects
AssigneeQUALCOMM Incorporated
InventorsKuiwon Kang, Hong Bok We, Chin-Kwan Kim, Milind Shah
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Abstract
A package comprising a substrate and an integrated device coupled to the substrate. The substrate includes at least one dielectric layer, a plurality of interconnects comprising a plurality of protruding pad interconnects, and a solder resist layer located over the at least one dielectric layer, the solder resist layer comprising a thickness that is greater than a thickness of the plurality of protruding pad interconnects. A protruding pad interconnect may include a first pad portion and a second pad portion.
Claims34
A package comprising:
- a substrate comprising:
- at least one dielectric layer;
- a plurality of interconnects comprising a plurality of protruding pad interconnects;
- and
- a solder resist layer located over the at least one dielectric layer, the solder resist layer comprising a thickness that is greater than a thickness of the plurality of protruding pad interconnects;
- wherein the plurality of protruding pad interconnects includes a first protruding pad interconnect comprising a first pad portion and a second pad portion coupled to the first pad portion, the first pad portion is centered directly underneath the second pad portion and located in the at least one dielectric layer;
- and
- a first integrated device coupled to the substrate.
An apparatus comprising:
- a substrate comprising:
- at least one dielectric layer;
- a plurality of interconnects comprising a plurality of protruding pad interconnects;
- a solder resist layer located over the at least one dielectric layer, the solder resist layer comprising a thickness that is greater than a thickness of the plurality of protruding pad interconnects;
- wherein the plurality of protruding pad interconnects includes a first protruding pad interconnect comprising a first pad portion and a second pad portion coupled to the first pad portion;
- and
- wherein the first pad portion is centered directly underneath the second pad portion and located in the at least one dielectric layer.
The method for fabricating a package, comprising:
- providing a substrate comprising:
- at least one dielectric layer;
- a plurality of interconnects comprising a plurality of protruding pad interconnects;
- and
- a solder resist layer located over the at least one dielectric layer, the solder resist layer comprising a thickness that is greater than a thickness of the plurality of protruding pad interconnects;
- wherein the plurality of protruding pad interconnects includes a first protruding pad interconnect comprising a first pad portion and a second pad portion coupled to the first pad portion, wherein the first pad portion is centered directly underneath the second pad portion and located in the at least one dielectric layer;
- and
- wherein the solder resist layer has an opening over the first protruding pad interconnect;
- coupling an integrated device to the substrate.
Dependencies are inferred from the claim text.