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US 11,776,884 B2Granted
Porous body on the side surface of a connector mounted to semiconductor device
AssigneesKabushiki Kaisha Toshiba, Toshiba Electronic Devices & Storage Corporation
InventorsYuning Tsai, Hidetoshi Kuraya
Life of this patent
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Abstract
A semiconductor device according to an embodiment includes a base frame, a semiconductor element provided on the base frame, a connector provided on the semiconductor element, the connector having an upper surface, a side surface, and a porous body having a plurality of pores provided on at least the side surface, and a molded resin provided in a periphery of the semiconductor element and at least the side surface of the connector. The upper surface of the connector is exposed.
Claims10
A semiconductor device comprising:
- a base frame;
- a semiconductor element provided on the base frame;
- a connector provided on the semiconductor element, the connector having an upper surface, a side surface, and a porous body having a plurality of pores provided on at least the side surface;
- and
- a molded resin provided in a periphery of the semiconductor element and at least the side surface of the connector,
- wherein the upper surface of the connector is exposed.
3 more elements
Dependencies are inferred from the claim text.