Method of fabricating a semiconductor package

A method of fabricating a semiconductor package, the method comprising:

• arranging a semiconductor device on a redistribution substrate, the semiconductor device having a first power electrode and a control electrode on a first surface and a second power electrode on a second surface opposite the first surface, the redistribution substrate comprising an insulating board having a first major surface and a second major surface having solderable contact pads that form a package footprint, so that the first power electrode is arranged on a first conductive pad and the control electrode is arranged on a second conductive pad on the first major surface of the insulating board;
• arranging a contact clip comprising a web portion and one or more peripheral rim portions on the semiconductor device such that the web portion is arranged on the second power electrode and the peripheral rim portion is arranged on a third conductive pad on the first major surface of the insulating board;
• electrically coupling the first power electrode, the control electrode and the peripheral rim portion to the respective conductive pads on the first major surface of the redistribution substrate and electrically coupling the web portion to the second power electrode,
• wherein the redistribution substrate comprises an aperture extending from the first major surface to the second major surface;
• arranging the first power electrode or the control electrode or the peripheral rim portion of the contact clip on the first major surface so that the first power electrode or the control electrode or the peripheral rim portion forms a base of the aperture;
• inserting solder into the aperture such that the solder is positioned on the first power electrode or the control electrode or the peripheral rim portion, on at least side faces of the aperture and on a solderable contact pad on the second major surface of the redistribution substrate;
• and
• melting the solder to electrically couple the first power electrode or the control electrode or the peripheral rim portion to the solderable contact pad.

A method of fabricating a semiconductor package, the method comprising:

• arranging a semiconductor device on a redistribution substrate, the semiconductor device having a first power electrode and a control electrode on a first surface and a second power electrode on a second surface opposite the first surface, the redistribution substrate comprising an insulating board having a first major surface and a second major surface having solderable contact pads that form a package footprint, so that the first power electrode is arranged on a first conductive pad and the control electrode is arranged on a second conductive pad on the first major surface of the insulating board;
• arranging a contact clip comprising a web portion and one or more peripheral rim portions on the semiconductor device such that the web portion is arranged on the second power electrode and the peripheral rim portion is arranged on a third conductive pad on the first major surface of the insulating board;
• electrically coupling the first power electrode, the control electrode and the peripheral rim portion to the respective conductive pads on the first major surface of the redistribution substrate and electrically coupling the web portion to the second power electrode,
• wherein the redistribution substrate comprises a first aperture and a second aperture both extending from the first major surface to the second major surface;
• arranging the first power electrode and the control electrode on the first major surface so that the first power electrode forms a base of the first aperture and the control electrode forms a base of the second aperture;
• inserting first solder into the first aperture such that the first solder is positioned on the first power electrode, on at least side faces of the first aperture and on a first solderable contact pad on the second major surface of the redistribution substrate;
• inserting second solder into the second aperture such that the second solder is positioned on the control electrode, on at least side faces of the second aperture and on a second solderable contact pad on the second major surface of the redistribution substrate;
• and
• melting the first solder to electrically couple the first power electrode to the first solderable contact pad and melting the second solder to electrically couple the control electrode to the second solderable contact pad.