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US 11,776,880 B2Granted
Surface treatment method and apparatus for semiconductor packaging
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsChih-Horng Chang, Jie-Cheng Deng, Tin-Hao Kuo, Ying-Yu Chen
Life of this patent
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Abstract
A surface treatment and an apparatus for semiconductor packaging are provided. A surface of a conductive layer is treated to create a roughened surface. In one example, nanowires are formed on a surface of the conductive layer. In the case of a copper conductive layer, the nanowires may include a CuO layer. In another example, a complex compound is formed on a surface of the conductive layer. The complex compound may be formed using, for example, thiol and trimethyl phosphite.
Claims20
A device comprising:
- a substrate;
- and
- a conductive layer on the substrate, a surface of the conductive layer comprising nanowires, the nanowires comprising Cu, CuO2, CuO, Cu(OH)2 and CuCO3, wherein an amount of CuO in the nanowires is greater than an amount of CuO2 in the nanowires, wherein the amount of CuO in the nanowires is greater than an amount of Cu in the nanowires, and wherein a combined amount of Cu(OH)2 and CuCO3 in the nanowires is greater than the amount of CuO in the nanowires.
A device comprising:
- a substrate;
- a conductive layer on the substrate;
- and
- a complex compound layer formed on the conductive layer, the complex compound layer covering an entirety of a top surface of the conductive layer, the conductive layer having a first amount of sulfur and a first amount of nitrogen, the complex compound layer having a second amount of sulfur and a second amount of nitrogen, the second amount of sulfur being greater than the first amount of sulfur, the second amount of nitrogen being greater than the first amount of nitrogen.
1 more element
A method comprising:
- forming a first conductive layer and a second conductive layer over a substrate;
- attaching an integrated circuit die to the first conductive layer, the second conductive layer being disposed between the substrate and the integrated circuit die;
- and
- after attaching the integrated circuit die to the first conductive layer, submerging the substrate with the integrated circuit die into a chemical solution, the chemical solution roughening a surface of the second conductive layer to form a roughened surface, the roughened surface facing a bottom surface of the integrated circuit die, the roughened surface comprising nanowires.
1 more element
Dependencies are inferred from the claim text.