Distributing heatsink load across a processor module with separable input/output (I/O) connectors
AssigneeInternational Business Machines Corporation
InventorsJason R. Eagle, Scott R. Lapree
Life of this patent
Estimating the term…
Abstract
A heatsink for distributing heatsink load across a processor module with separable input/output (I/O) connectors, comprising: a thermal conductor; and one or more pistons aligned with one or more separable interconnects of the processor module.
Claims17
A heatsink for distributed load over a processor module with one or more separable input/output (I/O) interconnects, comprising:
- a thermal conductor;
- and
- one or more pistons comprising one or more spring-loaded pistons, wherein each of the one or more pistons is positionally aligned with a corresponding separable I/O interconnect of the one or more separable I/O interconnects of the processor module, and wherein the one or more pistons are configured to touch the one or more separable I/O interconnects of the processor module.
An apparatus for distributed load over a processor module with separable input/output (I/O) connectors, comprising:
- the processor module comprising one or more separable I/O interconnects;
- and
- a heatsink comprising:
- a thermal conductor;
- and
- one or more pistons comprising one or more spring-loaded pistons, wherein each of the one or more pistons is aligned with a corresponding separable I/O interconnect of the one or more separable I/O interconnects of the processor module, and wherein the one or more pistons are configured to touch the one or more separable I/O interconnects of the processor module.
A method for coupling a heatsink for distributed load to a processor module with separable I/O connectors, comprising:
- aligning each of one or more pistons of the heatsink with a corresponding separable I/O interconnect of one or more separable I/O interconnects of the processor module, wherein the one or more pistons comprise one or more spring-loaded pistons, and wherein the one or more pistons are configured to touch the one or more separable I/O interconnects of the processor module;
- and
- thermally coupling a thermal conductor of the heatsink to the processor module.
Dependencies are inferred from the claim text.