Systems including a vapor chamber as the heat spreading substrate of a power device embedded in a PCB and methods of forming the same
AssigneesToyota Motor Engineering & Manufacturing North America, Inc., Toyota Jidosha Kabushiki Kaisha
InventorsFeng Zhou, Shohei Nagai, Hiroshi Ukegawa
Life of this patent
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Abstract
Embedded cooling systems and methods of forming the same are disclosed. A system may include a PCB stack comprising a first major substrate opposite a second major substrate, a pre-preg layer disposed between the first and second major substrates, a power device stack embedded within the PCB stack and comprising a substrate, a power device coupled to the substrate of the power device stack, and a vapor chamber embedded within at least the pre-preg layer of the PCB stack and the power device stack being coupled to the vapor chamber.
Claims18
A system comprising:
- a PCB stack comprising a first major substrate opposite a second major substrate;
- a pre-preg layer disposed between the first and second major substrates;
- a power device stack embedded within the PCB stack and comprising a substrate;
- a power device coupled to the substrate of the power device stack, wherein the substrate of the power device stack comprises a cavity for receiving the power device;
- and
- a vapor chamber coupled to the power device stack, the vapor chamber being at least partially embedded within the PCB stack.
A method comprising:
- forming a PCB stack having a first major substrate opposite a second major substrate and a pre-preg layer disposed between the first and second major substrates;
- forming a recess within the PCB stack to receive a power device stack coupled to a vapor chamber;
- machining a cavity within a substrate to receive a power device;
- bonding the power device to the substrate to form the power device stack;
- bonding the power device stack to the vapor chamber;
- and
- embedding the power device stack coupled to the vapor chamber within the recess.
A system comprising:
- a printed circuit board (PCB) stack comprising a first major substrate opposite a second major substrate and a pre-preg layer disposed between the first and second major substrates;
- a plurality of power device stacks embedded within the PCB stack, each comprising a substrate having a cavity formed therein and an electrical insulation layer disposed on a surface of the substrate opposite the cavity;
- a plurality of power devices, each of the plurality of power devices received within the cavity of the substrate of each of the plurality of power device stacks and thermally coupled to the substrate;
- one or more vapor chambers embedded within the PCB stack and thermally bonded to the electrical insulation layer of one or more of the plurality of power device stacks;
- and
- at least one cooling assembly thermally coupled to the PCB stack.
Dependencies are inferred from the claim text.