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US 11,776,871 B2Granted
Module with substrate recess for conductive-bonding component
AssigneeSemiconductor Components Industries, LLC
InventorsLeo Gu, Sixin Ji, Jie Chang, Keunhyuk Lee, Yong Liu
Life of this patent
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Abstract
In one general aspect, an apparatus can include a semiconductor component, a substrate including a recess, and a conductive-bonding component. The conductive-bonding component is disposed between the semiconductor component and the substrate. The conductive-bonding component has a first thickness between a bottom of the recess and a bottom surface of the semiconductor component greater than a second thickness between the top of the substrate and the bottom surface of the semiconductor component.
Claims19
An apparatus, comprising:
- a semiconductor component;
- a substrate including a channel having an outer edge disposed outside of an outer perimeter of the semiconductor component;
- and
- a conductive-bonding component,
- the conductive-bonding component disposed between the semiconductor component and the substrate, the conductive-bonding component having a first thickness between a bottom of the channel and a bottom surface of the semiconductor component greater than a second thickness between a top of the substrate and the bottom surface of the semiconductor component, and
- the channel being in fluid communication with an overflow channel that extends from the channel and is a same width as the channel.
3 more elements
An apparatus, comprising:
- an aluminum spacer;
- a substrate including a channel;
- and
- a conductive-bonding component,
- the aluminum spacer being coupled to the substrate via the conductive-bonding component, the channel having an inner edge and an outer edge, the inner edge defining a mesa disposed below the aluminum spacer, the outer edge of the channel is disposed outside of an outer perimeter of the aluminum spacer.
2 more elements
An apparatus, comprising:
- a semiconductor component;
- a substrate including a channel having an inner edge and an outer edge, the outer edge being disposed outside of an outer perimeter of the semiconductor component, the inner edge of the channel defining a mesa disposed below the semiconductor component, the channel is in fluid communication with a first overflow channel and a second overflow channel aligned orthogonal to the first overflow channel;
- a conductive-bonding component;
- and
- the conductive-bonding component disposed between the semiconductor component and the substrate.
2 more elements
Dependencies are inferred from the claim text.