Package with a highly conductive layer deposited on die using throughput additive deposition prior to TIM1 dispense

A device package, comprising:

• one or more dies disposed on a substrate;
• a first layer laterally adjacent to a second layer on one of the one or more dies, the first layer comprising copper (Cu), nickel (Ni) or aluminum (Al), and the second layer comprising Cu, Ni or Al, the second layer having a different composition than the first layer;
• and
• a lid with one or more legs on an outer periphery of the lid, a top surface, and a bottom surface that is opposite from the top surface, wherein the one or more legs of the lid are attached to the substrate with a sealant, and wherein the bottom surface of the lid is disposed over the first and second layers and the one or more dies on the substrate.

A device package, comprising:

• one or more dies disposed on a substrate;
• one or more conductive layers disposed on the one or more dies, wherein the one or more conductive layers are directly disposed on the top surface of the one or more dies without an adhesive layer, and wherein the one or more conductive layers comprises a first conductive layer laterally adjacent to a second conductive layer on one of the one or more dies, the second conductive layer different than the first conductive layer;
• a lid with one or more legs on an outer periphery of the lid, a top surface, and a bottom surface that is opposite from the top surface, wherein the one or more legs of the lid are attached to the substrate with a sealant, and wherein the bottom surface of the lid is disposed over the one or more conductive layers and the one or more dies on the substrate;
• and
• one or more thermal interface materials (TIMs) disposed on the one or more conductive layers, wherein the one or more TIMs are disposed between the bottom surface of the lid and one or more top surfaces of the one or more conductive layers.