Methods for establishing thermal joints between heat spreaders or lids and heat sources
AssigneeLaird Technologies, Inc.
InventorsJason L. Strader, Richard F. Hill
Life of this patent
Estimating the term…
Abstract
According to various aspects, exemplary embodiments are disclosed of thermal interface materials, electronic devices, and methods for establishing thermal joints between heat spreaders or lids and heat sources. In exemplary embodiments, a method of establishing a thermal joint for conducting heat between a heat spreader and a heat source of an electronic device generally includes positioning a thermal interface material (TIM1) between the heat spreader and the heat source.
Claims27
A method of establishing a thermal path for conducting heat from a heat source of an electronic device, the heat source having a normal operating temperature range, the method comprising:
- using a solvent-based thermal interface material having an initial flowable state to form a thin bond line between the heat source and another component of the electronic device to thereby establish the thermal path without heating the solvent-based thermal interface material to a temperature within a range while under pressure;
- and
- allowing evaporation of solvent from the solvent-based thermal interface material such that the remaining thermal interface material is in and remains in a resistant-to-flow state forming the thin bond line between the heat source and the another component, whereby the remaining thermal interface material is operable to preclude the heat source from heating beyond the normal operating temperature range during operation of the electronic device and heat is flowable through the thermal path from the heat source during operation of the electronic device whereby temperature of the heat source is reduced.
A method of establishing a thermal path for conducting heat from a heat source of an electronic device, the heat source having a normal operating temperature range, the method comprising using a thermal interface material between the heat source and another component of the electronic device to form a thin bond line between the heat source and the another component to thereby establish the thermal path, the thermal interface material configured to be in and remain in a resistant-to-flow state after forming the thin bond line between the heat source and the another component absent heating of the thermal interface material to a temperature within a range while under pressure, whereby the thermal interface material is operable to preclude the heat source from heating beyond the normal operating temperature range during operation of the electronic device and heat is flowable through the thermal path from the heat source during operation of the electronic device whereby temperature of the heat source is reduced.
A thermal interface material for establishing a thermal path for conducting heat from a heat source of an electronic device, the heat source having a normal operating temperature range, the thermal interface material comprises a solvent-based thermal interface material having an initial flowable state in which the solvent-based thermal interface material is flowable to form a thin bond line between the heat source and another component of the electronic device to thereby establish the thermal path without requiring heating of the solvent-based thermal interface material to a temperature within a range while under pressure, wherein after evaporation of solvent from the solvent-based thermal interface material, the remaining thermal interface material is configured to be in and remain in a resistant-to-flow state forming the thin bond line between the heat source and the another component, whereby the remaining thermal interface material is operable to preclude the heat source from heating beyond the normal operating temperature range during operation of the electronic device and heat is flowable through the thermal path from the heat source during operation of the electronic device whereby temperature of the heat source is reduced.
A thermal interface material for establishing a thermal path for conducting heat from a heat source of an electronic device, the heat source having a normal operating temperature range, the thermal interface material is positionable between the heat source and another component of the electronic device and configured to form a thin bond line between the heat source and the another component to thereby establish the thermal path, the thermal interface material configured to be in an remain in a resistant-to-flow state after forming the thin bond line between the heat source and the another component absent heating of the thermal interface material to a temperature within a range while under pressure, whereby the thermal interface material is operable to preclude the heat source from heating beyond the normal operating temperature range during operation of the electronic device and heat is flowable through the thermal path from the heat source during operation of the electronic device whereby temperature of the heat source is reduced.
Dependencies are inferred from the claim text.