Corner guard for improved electroplated first level interconnect bump height range

An electronic package, comprising:

• a package substrate;
• a first level interconnect (FLI) bump region over the package substrate, the FLI bump region comprising:
• a plurality of pads;
• and
• a plurality of bumps, wherein each of the bumps is over a different one of the plurality of pads;
• and
• a guard feature adjacent to the FLI bump region, the guard feature having substantially the same height as a bump of the plurality of bumps of the FLI bump region, wherein the guard feature comprises the same material as the plurality of bumps, and wherein the guard feature is electrically isolated from circuitry of the electronic package;
• and
• a die electrically coupled to the package substrate by the plurality of bumps, the die having a footprint, wherein the plurality of bumps is within the footprint of the die, and the guard feature is outside of the footprint of the die.

An electronic system, comprising:

• a board;
• an electronic package electrically coupled to the board, wherein the electronic package comprises:
• a first level interconnect (FLI) bump region;
• and
• a guard feature proximate to the FLI bump region, the guard feature having substantially the same height as a bump of the FLI bump region, wherein the guard feature is electrically isolated from circuitry of the electronic system;
• and
• a die electrically coupled to the electronic package, the die having a footprint, wherein the FLI bump region is within the footprint of the die, and the guard feature is outside of the footprint of the die.