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US 11,776,863 B2Granted
Semiconductor device package
AssigneeAdvanced Semiconductor Engineering, Inc.
InventorsHao-Chih Hsieh, Tun-Ching Pi, Sung-Hung Chiang, Yu-Chang Chen
Life of this patent
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Abstract
A semiconductor device package includes a carrier, a first interposer disposed and a second interposer. The second interposer is stacked on the first interposer, and the first interposer is mounted to the carrier. The combination of the first interposer and the second interposer is substantially T-shaped.
Claims9
An electronic device, comprising:
- a carrier;
- an interposer on the carrier and configured to electrically connect an external component to the carrier;
- and
- a first encapsulant on the carrier and configured to support the interposer,
- wherein the carrier has a first surface and a second surface opposite to the first surface, and wherein the first encapsulant is disposed on the first surface of the carrier and a second encapsulant is disposed on the second surface of the carrier,
- wherein a portion of the second surface of the carrier is free from being covered by the second encapsulant,
- wherein the interposer at least partially overlaps the portion of the second surface of the carrier.
4 more elements
An electronic device, comprising:
- a carrier;
- an interposer on the carrier and configured to electrically connect an external component to the carrier;
- and
- a first encapsulant on the carrier and configured to support the interposer,
- wherein the first encapsulant at least partially exposes two lateral surfaces of the interposer.
2 more elements
An electronic device, comprising:
- a carrier;
- an interposer on the carrier and configured to electrically connect an external component to the carrier;
- and
- a first encapsulant on the carrier and configured to support the interposer,
- wherein the first encapsulant exposes a surface of the interposer, and wherein the surface of the interposer faces away from the carrier.
2 more elements
An electronic device, comprising:
- a carrier having a first surface and a second surface opposite to the first surface;
- a first interposer adjacent to the first surface of the carrier and configured to electrically connect an external component to the carrier;
- a first encapsulant adjacent to the second surface of the carrier and exposing a portion of the second surface of the carrier;
- a second component disposed on the first surface of the carrier, wherein the second component is at least partially covered by the first interposer;
- and;
- a second interposer between the first interposer and the carrier, wherein a height of the second interposer is greater than a height of the third component.
3 more elements
Dependencies are inferred from the claim text.