Lid structure and semiconductor device package including the same
AssigneeAdvanced Semiconductor Engineering, Inc.
InventorsChun-Han Chen, Hsun-Wei Chan, Mei-Yi Wu
Life of this patent
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Abstract
The present disclosure relates to a semiconductor device package, which includes a carrier, a lid, a first adhesive layer and a constraint structure. The carrier includes a surface and a first conductive pad on the surface of the carrier. The lid includes a first portion and a second portion separated from the first portion on the surface of the carrier. The first conductive pad is disposed between the first portion of the lid and the surface of the carrier. The first adhesive layer includes a first portion between the first portion of the lid and the first conductive pad. The constraint structure surrounds the first adhesive layer.
Claims7
A semiconductor device package, comprising:
- a carrier comprising a surface including a non-conductive area and a conductive area;
- a conductive lid disposed on the carrier;
- a conductive adhesive layer between the conductive area and the conductive lid;
- a non-conductive adhesive layer between the surface of the carrier and the conductive lid;
- and
- a constraint structure between the non-conductive area and the conductive area of the carrier to constrain the conductive adhesive layer and the non-conductive adhesive layer;
- wherein the conductive lid comprises a first portion and a second portion separated from the first portion on the surface of the carrier, and wherein the second portion defines a space;
- wherein the conductive lid defines a trench between the first portion and the second portion of the conductive lid;
- and
- wherein the non-conductive adhesive layer comprises a first portion in the trench.
A semiconductor device package, comprising:
- a carrier comprising a surface including a non-conductive area and a conductive area;
- a conductive lid disposed on the carrier;
- a conductive adhesive layer between the conductive area and the conductive lid;
- a non-conductive adhesive layer between the surface of the carrier and the conductive lid;
- and
- a constraint structure between the non-conductive area and the conductive area of the carrier to constrain the conductive adhesive layer and the non-conductive adhesive layer;
- wherein the conductive lid comprises a first portion and a second portion separated from the first portion on the surface of the carrier, and wherein the second portion defines a space;
- wherein the conductive lid defines a trench between the first portion and the second portion of the conductive lid;
- and
- wherein the conductive adhesive layer comprises a portion in the trench.
A semiconductor device package, comprising:
- a carrier comprising a surface including a non-conductive area and a conductive area;
- a conductive lid disposed on the carrier;
- a conductive adhesive layer between the conductive area and the conductive lid;
- a non-conductive adhesive layer between the surface of the carrier and the conductive lid;
- and
- a constraint structure between the non-conductive area and the conductive area of the carrier to constrain the conductive adhesive layer and the non-conductive adhesive layer;
- wherein the conductive lid comprises a first portion and a second portion separated from the first portion on the surface of the carrier, and wherein the second portion defines a space;
- wherein the conductive lid defines a trench between the first portion and the second portion of the conductive lid;
- and
- wherein the trench surrounds the first portion of the conductive lid.
Dependencies are inferred from the claim text.