Compartment shielding with metal frame and cap
AssigneeSTATS ChipPAC Pte. Ltd.
InventorsBokyeong Hwang, Jingwan Kim, Minjung Kim
Life of this patent
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Abstract
A semiconductor device has a substrate and a first semiconductor die disposed over the substrate. A first metal frame is disposed over the substrate around the first semiconductor die. A first metal lid is disposed over the first metal frame. A flap of the first metal lid includes an elastic characteristic to latch onto the first metal frame. An edge of the flap can have a castellated edge. A recess in the first metal frame and a protrusion on the first metal lid can be used to latch the first metal lid onto the first metal frame. A second metal frame and second metal lid can be disposed over an opposite surface of the substrate from the first metal frame.
Claims13
A method of making a semiconductor device, comprising:
- providing a substrate;
- disposing a first semiconductor die over a first surface of the substrate;
- disposing a first metal frame over the substrate around the first semiconductor die;
- disposing a first metal lid over the first metal frame, wherein a flap of the first metal lid includes an elastic characteristic to latch onto the first metal frame;
- disposing a second metal frame over a second surface of the substrate opposite the first surface;
- disposing a second metal lid over the second metal frame;
- and
- disposing a solder bump over the second surface of the substrate, wherein a height of the solder bump is greater than a height of the second metal frame and second metal lid.
A semiconductor device, comprising:
- a substrate;
- a first semiconductor die disposed over a first surface of the substrate;
- a first metal frame disposed over the first surface of the substrate around the first semiconductor die;
- a first metal lid disposed over the first metal frame, wherein a flap of the first metal lid includes an elastic characteristic to latch onto the first metal frame;
- a second metal frame disposed over a second surface of the substrate opposite the first surface;
- a second metal lid disposed over the second metal frame;
- and
- a solder bump disposed over the second surface of the substrate, wherein a height of the solder bump is greater than a height of the second metal frame and second metal lid.
Dependencies are inferred from the claim text.