Method of manufacturing electronic devices with a cap and molding

A method of manufacturing an electronic device,

• the electronic device including:
• a substrate having a first surface and a second surface that are in a front and back relationship with each other;
• a first electronic component mounted on the first surface of the substrate;
• a lead bonded to the substrate;
• a cap disposed on the first surface and accommodating the first electronic component between the cap and the substrate;
• and
• a mold portion molding a bonding portion between the lead and the substrate and bonding the cap and the substrate,
• the method of manufacturing the electronic device comprising:
• a preparation step of preparing the substrate on which the first electronic component is mounted and to which the lead is bonded;
• and
• a molding step of mounting the cap in a mold in a state in which the cap is disposed on the substrate, and forming the mold portion by filling a mold material into the mold, wherein
• the mold includes
• a first mold including a cap mounting portion in which the cap is mounted, and
• a second mold including a lead pressing portion configured to press the lead to elastically deform the lead, and
• the molding step includes
• mounting the cap in the cap mounting portion,
• mounting the substrate on the cap,
• pressing the lead by the lead pressing portion to elastically deform the lead, and biasing the substrate toward the cap side by a restoring force generated in the lead, and
• filling the mold material into the mold.