A method for transferring blocks from a donor substrate to a receiver substrate, comprising the following steps:
- arranging a mask facing a free surface of the donor substrate, the mask having one or more openings that expose the free surface of the donor substrate, the one or more openings being distributed according to a given block pattern to form at least one exposed region of the free surface of the donor substrate and at least one region covered by the mask;
- forming, by ion implantation through the mask, an embrittlement plane localized in the donor substrate vertically in line with the at least one exposed region, the embrittlement plane delimiting, in a thickness of the donor substrate, a respective surface region;
- forming a block that is raised relative to the free surface of the donor substrate localized vertically in line with each respective embrittlement plane, the block comprising the respective surface region;
- bonding the donor substrate to the receiver substrate via each block at a bonding interface, after having removed the mask;
- and
- detaching the donor substrate along each localized embrittlement plane to transfer each respective block to the receiver substrate.