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US 11,776,842 B2Granted
Method and device for surface treatment of substrates
AssigneeEV Group E. Thallner GmbH
InventorMarkus Wimplinger
Life of this patent
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Abstract
A method for surface treatment of an at least primarily crystalline substrate surface of a substrate such that by amorphization of the substrate surface, an amorphous layer is formed at the substrate surface with a thickness d>0 nm of the amorphous layer. This invention also relates to a corresponding device for surface treatment of substrates.
Claims19
A method for surface treatment of an at least primarily crystalline substrate surface of a substrate, the method comprising:
- amorphizing the substrate surface to form an amorphous layer for bonding at the substrate surface of the substrate, the amorphous layer having a thickness d>0 nm;
- and
- converting the amorphous layer via recrystallization to effect a continuous reduction of the amorphous layer from the thickness d to a final layer thickness d″ of the converted amorphous layer,
- wherein a ratio between the final layer thickness d″ and the thickness d is less than 1.
1 more element
A device for surface treatment of a substrate surface of a substrate, the device comprising:
- a process chamber for receiving the substrate;
- means for amorphizing the substrate surface to form an amorphous layer for bonding at the substrate surface of the substrate, the amorphous layer having a thickness d>0 nm;
- and
- means for converting the amorphous layer via recrystallization to effect a continuous reduction of the amorphous layer from the thickness d to a final layer thickness d″ of the converted amorphous layer to achieve a ratio between the final layer thickness d″ and the thickness of less than 1.
1 more element
Dependencies are inferred from the claim text.