Vacuum processing device

A vacuum processing device in which a loading/unloading port is provided to load and unload a substrate transfer container, a normal pressure transfer chamber is provided to have therein a normal pressure transfer arm for transferring a substrate to and from the substrate transfer container mounted on the loading/unloading port under a normal pressure atmosphere, and a vacuum transfer chamber in a vacuum atmosphere is provided, and the loading/unloading port, the normal pressure transfer chamber and the vacuum transfer chamber are arranged in that order from a front side toward a rear side, the vacuum processing device comprising:

• a vacuum transfer mechanism disposed in the vacuum transfer chamber and having a holder configured to hold a substrate on each of a tip end and a base end thereof;
• a plurality of vacuum processing modules airtightly connected to each of a right side and a left side of the vacuum transfer chamber when viewed from the loading/unloading port, wherein a substrate held on the tip end and a substrate held on the base end of the holder are collectively loaded into one of the vacuum processing modules, and vacuum processing is performed on substrates;
• and
• load-lock chambers disposed on the right side and the left side when viewed from the loading/unloading port and having an inner atmosphere switched between a normal pressure atmosphere and a vacuum atmosphere, wherein a substrate held on the tip end and a substrate held on the base end of the holder are collectively loaded into and unloaded from each of the load-lock chambers, and a substrate is loaded into and unloaded from each of the load-lock chambers by the normal pressure transfer arm,
• wherein the normal pressure transfer arm has a substrate transfer area enclosed by the normal pressure transfer chamber, and each of the load-lock chambers has a plurality of mounting shelves for mounting at least two substrates, the at least two substrates being positioned side-by-side in the load-lock chambers,
• wherein the load-lock chambers are positioned above the normal pressure transfer chamber such that the substrate transfer area overlaps with the plurality of mounting shelves when viewed from a top of the vacuum processing device,
• wherein each of the load-lock chambers is arranged such that a line connecting centers of two substrates mounted side-by-side in the load-lock chamber intersects with a central axis extending from the front side to the rear side of the vacuum processing device.