Substrate processing method and substrate processing apparatus
AssigneeKioxia Corporation
InventorsMana Tanabe, Kosuke Takai, Kenji Masui, Kaori Umezawa
Life of this patent
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Abstract
A substrate processing method includes a process of cooling a substrate to below a freezing point of a processing liquid using a cooling fluid brought into contact with the substrate opposite. While the substrate is cooled to below the freezing point of the processing liquid, a droplet of processing liquid is dispensed onto a surface of the substrate at a specified location of a foreign substance. The droplet then forms a frozen droplet portion at the specified location. The frozen droplet portion is then thawed.
Claims14
A substrate processing apparatus, comprising:
- a substrate holder configured to hold a substrate with a first surface thereof facing upward;
- a processing liquid supply unit including a first nozzle configured to supply a processing liquid onto the first surface;
- a freezing unit configured to supply a cooling fluid to the substrate and freeze processing liquid on the first surface;
- a drive mechanism configured to position the nozzle with respect to the substrate holder by relative movements of the first nozzle and substrate holder;
- and
- a control unit configured to control:
- the freezing unit to supply the cooling fluid to the substrate,
- the drive mechanism to position the first nozzle above a specified location of a foreign substance on the first surface of the substrate, and
- the processing liquid supply unit to dispense a droplet of the processing liquid from the first nozzle positioned above the specified location of the foreign substance while the freezing unit is supplying the cooling fluid to the substrate, wherein
- the specified location of the foreign substance is obtained by reference to foreign substance location information supplied to the control unit.
A substrate processing apparatus, comprising:
- a substrate holder configured to hold a substrate with a first surface thereof facing upward;
- a processing liquid supply unit including a first nozzle configured to supply a processing liquid onto the first surface;
- a freezing unit configured to supply a cooling fluid to a second surface of the substrate, the second surface opposite the first surface;
- and
- a control unit configured to:
- control the processing liquid supply unit to dispense the processing liquid from the first nozzle onto the first surface of the substrate to form a liquid film covering the first surface;
- control the freezing unit to cool the substrate to below a freezing point of the processing liquid using the cooling fluid brought into contact with the second surface of the substrate to form a frozen layer of processing liquid from the liquid film on the first surface;
- control the processing liquid supply unit to dispense a droplet of processing liquid onto the frozen layer of processing liquid on the first surface at a specified location to thaw a portion of the frozen layer of processing liquid at the specified location and form a frozen droplet portion at the specified location, the frozen droplet portion comprising the dispensed droplet of processing liquid and the thawed portion of the frozen layer;
- and
- control the freezing unit to thaw the frozen droplet portion.
Dependencies are inferred from the claim text.