Micro-electronic package with substrate protrusion to facilitate dispense of underfill between a narrow die-to-die gap

A method, comprising:

• dispensing underfill material toward a protrusion between adjacent dies, wherein the protrusion extends from a substrate, the protrusion having a first sidewall and a second sidewall, the second sidewall laterally opposite the first sidewall, and the protrusion having a lateral width between the first sidewall and the second sidewall, wherein the adjacent dies are laterally spaced apart from one another by a lateral distance greater than the lateral width of the protrusion;
• causing the underfill material to contact the protrusion;
• and
• causing the underfill material to fill space underneath the adjacent dies based on the contact with the protrusion.

A method of fabricating a package, the method comprising:

• forming a substrate comprising a protrusion, the protrusion having a first sidewall and a second sidewall, the second sidewall laterally opposite the first sidewall, and the protrusion having a lateral width between the first sidewall and the second sidewall;
• coupling a first die to the substrate;
• coupling a second die to the substrate, the protrusion between the first die and the second die, wherein the second die is laterally spaced apart from the first die by a lateral distance greater than the lateral width of the protrusion;
• and
• forming an encapsulant over the protrusion of the substrate, the encapsulant extending beneath the first die, and the encapsulant extending beneath the second die.