Fabrication of a semiconductor device

A method for fabricating a semiconductor structure comprising a semiconductor material, the method comprising:

• providing a template structure, the template structure comprising an opening, a cavity and a seed structure, the seed structure comprising a seed material and a seed surface, wherein a surface of the template structure comprises at least one metallic surface area comprising a metallic material, wherein the providing the template structure comprises:
• forming a first template layer on a sacrificial layer;
• patterning the sacrificial layer and the first template layer;
• forming a second template layer on the first template layer and a substrate;
• forming an opening in the second template layer;
• and
• selectively removing a part of seed material of the sacrificial layer, thereby forming the cavity;
• and
• growing the semiconductor structure within the cavity of the template structure from the seed surface along the metallic surface area.