Plasma processing apparatus and power supply control method
AssigneeTokyo Electron Limited
InventorsKoichi Nagami, Tatsuro Ohshita
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AssigneeTokyo Electron Limited
InventorsKoichi Nagami, Tatsuro Ohshita
Estimating the term…
A plasma processing apparatus includes: a placement table serving as a lower electrode and configured to place thereon a workpiece to be subjected to a plasma processing; a DC power supply configured to alternately generate a positive DC voltage and a negative DC voltage to be applied to the placement table; and a controller configured to control an overall operation of the plasma processing apparatus. The controller is configured to: measure a voltage of the workpiece placed on the placement table; calculate, based on the measured voltage of the workpiece, a potential difference between the placement table and the workpiece in a period during which the negative DC voltage is applied to the placement table; and control the DC power supply such that a value of the negative DC voltage applied to the placement table is shifted by a shift amount that decreases the calculated potential difference.
A plasma processing apparatus comprising:
A plasma processing method comprising:
Dependencies are inferred from the claim text.