Electrostatic chuck assembly for cryogenic applications
AssigneeApplied Materials, Inc.
InventorVijay D. Parkhe
Life of this patent
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Abstract
Embodiments of the present disclosure generally relate to an electrostatic chuck assembly suitable for use in cryogenic applications. In one or more embodiments, an electrostatic chuck assembly is provided and includes an electrostatic chuck having a substrate supporting surface opposite a bottom surface, a cooling plate having a top surface, where the cooling plate contains an aluminum alloy having a coefficient of thermal expansion (CTE) of less than 22 ppm/° C., and a bonding layer securing the bottom surface of the electrostatic chuck and the top surface of the cooling plate, where the bonding layer contains a silicone material.
Claims20
An electrostatic chuck assembly, comprising:
- an electrostatic chuck having a workpiece supporting surface opposite a bottom surface;
- a cooling plate having a top surface, wherein the cooling plate comprises an aluminum alloy having a coefficient of thermal expansion (CTE) of less than 22 parts per million/° C. (ppm/° C.), wherein the cooling plate comprises a stack of alternating layers comprising a first layer and a second layer, and wherein the first layer comprises the aluminum alloy and the second layer comprises molybdenum;
- and
- a bonding layer securing the bottom surface of the electrostatic chuck and the top surface of the cooling plate, wherein the bonding layer comprises a silicone material.
An electrostatic chuck assembly, comprising:
- an electrostatic chuck having a workpiece supporting surface opposite a bottom surface;
- a cooling plate comprising an aluminum alloy, wherein the aluminum alloy comprises aluminum and silicon and has a coefficient of thermal expansion (CTE) of less than 22 parts per million/° C. (ppm/° C.);
- and
- a bonding film disposed between the electrostatic chuck and the cooling plate, wherein the bonding film comprises a bonding layer comprising a silicone material, wherein the silicone material comprises alkyl phenyl silicone.
An electrostatic chuck assembly, comprising:
- an electrostatic chuck having a workpiece supporting surface opposite a bottom surface;
- a cooling plate comprising an aluminum alloy, wherein the aluminum alloy comprises aluminum and silicon and has a coefficient of thermal expansion (CTE) of less than 22 parts per million/° C. (ppm/° C.);
- and
- a bonding film disposed between the electrostatic chuck and the cooling plate, wherein the bonding film comprises:
- a bonding layer comprising a silicone material, wherein the silicone material comprises alkyl phenyl silicone;
- an indium-containing layer;
- and
- a secondary metal layer disposed between the bonding layer and the indium-containing layer, wherein the secondary metal layer comprises molybdenum, tungsten, chromium, and alloys thereof.
Dependencies are inferred from the claim text.