Ceramic electronic component, substrate arrangement and method of manufacturing ceramic electronic component

A ceramic electronic component comprising:

• an element body having a dielectric, a first internal electrode and a second internal electrode, the element body having a plurality of surfaces including at least one first surface and opposite side surfaces;
• and
• a first external electrode and a second external electrode formed on the element body,
• the first external electrode including:
• a first base layer formed on the element body such that the first base layer is connected to the first internal electrode and an edge of the first baser layer is present on the at least one first surface of the element body;
• and
• a first plating layer formed on the first base layer such that an edge of the first plating layer is present on the at least one first surface of the element body at a position different from a position of the edge of the first base layer in a direction perpendicular to the at least one first surface of the element body,
• the second external electrode including:
• a second base layer formed on the element body such that the second base layer is connected to the second internal electrode and an edge of the second baser layer is present on the at least one first surface of the element body;
• and
• a second plating layer formed on the second base layer such that an edge of the second plating layer is present on the at least one first surface of the element body at a position different from a position of the edge of the second base layer in the direction perpendicular to the at least one first surface of the element body.