Liquid metal conductive paste and electronic device
AssigneeBeijing Dream Ink Technologies Co., Ltd.
InventorsPing Li, Shijin Dong, Zhenlong Men
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Abstract
The present disclosure provides a liquid metal conductive paste and an electronic device, and relates to a technical field of new materials. The liquid metal conductive paste provided by the present disclosure includes: 1%-50% by weight of a liquid metal microcapsule, 30%-80% by weight of a conductive powder, 1%-25% by weight of a base polymer and 10%-40% by weight of a solvent. A capsule wall of the liquid metal microcapsule is made of a coating polymer, and a capsule core is made of a liquid metal. Melting point of the liquid metal satisfies: the liquid metal is in a liquid state at least when the wire made of the liquid metal conductive paste is deformed. The present disclosure can achieve a better flexible wire.
Claims20
A liquid metal conductive paste, comprising:
- 1% to 50% by weight of a liquid metal microcapsule;
- 30% to 80% by weight of a conductive powder;
- 1% to 25% by weight of a base polymer;
- and
- 10% to 40% by weight of a solvent,
- wherein the liquid metal microcapsule has a capsule wall of a coating polymer, and a capsule core of a liquid metal;
- and melting point of the liquid metal satisfies a condition that the liquid metal is in a liquid state at least when a wire made of the liquid metal conductive paste is deformed.
A liquid metal conductive paste, comprising:
- 1% to 50% by weight of a liquid metal microcapsule;
- 30% to 80% by weight of a conductive powder;
- 1% to 25% by weight of a base polymer;
- 10% to 40% by weight of a solvent;
- and
- 1% to 15% by weight of a crosslinking agent,
- wherein the liquid metal microcapsule has a capsule wall of a coating polymer, and a capsule core of a liquid metal;
- and melting point of the liquid metal satisfies the condition that the liquid metal is in a liquid state at least when a wire made of the liquid metal conductive paste is deformed;
- and the crosslinking agent is configured to have a crosslinking reaction with the coating polymer and/or the base polymer to form a three dimensional network structure during a curing process of the wire made of the liquid metal conductive paste.
Dependencies are inferred from the claim text.