Biometric sensor module for a smart card and method for manufacturing such a module

Method for producing a biometric sensor module for a chip card, comprising steps of:

• providing a dielectric carrier comprising a front face and a back face, both forming main faces of the carrier,
• attaching a biometric sensor for detecting fingerprints to the back face, a detection area covered by the sensor on the back face being placed opposite a detection region located on the front face of the carrier,
• providing a protective layer of a photoimageable coverlay material on the detection region,
• providing a bezel on the front face, where the protective layer covers a region located inside the bezel, and
• on the back face, providing electrically conductive connection pads, where the electrically conductive connection pads are placed essentially opposite a region of the front face covered with the bezel, and
• providing at least one conductive via in the thickness of the carrier, the at least one conductive via electrically connecting the bezel to the electrically conductive connection pads.

Method for producing a biometric sensor module for a chip card, comprising steps of:

• providing a dielectric carrier comprising a front face and a back face, both forming main faces of the carrier,
• attaching a biometric sensor for detecting fingerprints to the back face, a detection area covered by the sensor on the back face being placed opposite a detection region located on the front face of the carrier,
• providing a protective layer of a photoimageable coverlay material on the detection region,
• where the front face is coated with an electrically conductive layer, in which the bezel is made, the protective layer covering an area located inside the bezel on the front face, and
• where the at least one conductive via is made in the thickness of the carrier to electrically connect the bezel to the back face.