Methods, systems, and computer program products for efficiently implementing a 3D-IC

A non-transitory computer readable medium having stored thereupon a sequence of instructions which, when executed by a processor causes a set of acts for concurrently implementing a three-dimensional (3D) electronic design using an electronic design automation tool, the set of acts comprising:

• identifying a first die design and a second die design in a three-dimensional (3D) electronic design, wherein the first die design requires a first technology file, and the second die design requires a second technology file different from the first technology file;
• and
• performing the concurrent implementation for both the first and the second dies of the 3D electronic design using only one of the first and second technology files loaded into an electronic design automation tool session at a time comprising:
• generating wrapper designs for circuit component designs in the second die design, wherein use of the wrapper designs does not require use of the second technology file to perform at least floorplanning and a wrapper design comprises a representation of a corresponding circuit component design as a timing or interface model, a footprint, and one or more connections to the first die design;
• and
• generating, concurrently, a floorplan for both the first and the second dies of the 3D electronic design using at least the wrapper designs for the circuit component designs in the second die design, the first die design, the first technology file, and without using the second technology file.

A system for concurrently implementing a three-dimensional (3D) electronic design using an electronic design automation tool, the system comprising:

• a memory storing a set of instructions;
• and
• a processor that that executes the set of instructions to perform a set of acts, the set of acts comprising:
• identifying a first die design and a second die design in a three-dimensional (3D) electronic design, wherein the first die design requires a first technology file, and the second die design requires a second technology file different from the first technology file;
• and
• performing the concurrent implementation for both the first and the second dies of the 3D electronic design using only one of the first and second technology files loaded into an electronic design automation tool session at a time comprising:
• generating wrapper designs for circuit component designs in the second die design, wherein use of the wrapper designs does not require use of the second technology file to perform at least floorplanning and a wrapper design comprises a representation of a corresponding circuit component design as a timing or interface model, a footprint, and one or more connections to the first die design;
• and
• generating, concurrently, a floorplan for both the first and the second dies of the 3D electronic design-using at least the wrapper designs for the circuit component designs in the second die design, the first die design, the first technology file, and without using the second technology file.