Determining mechanical reliability of electronic packages assembled with thermal pads

A computer-implemented system for determining mechanical properties of an assembly, the computer-implemented system comprising:

• one or more data processors;
• one or more non-transitory computer-readable storage mediums encoded with instructions for commanding the one or more data processors to execute steps that comprise:
• receiving an input specification for a model of the assembly, wherein the input specification includes a compressible body and a surrounding component in the electronic assembly;
• identifying a geometric interference in the model as an overlap between the compressible body and the surrounding component;
• generating a displacement for the compressible body to account for the geometric interference;
• updating the model with the displacement;
• and
• determining a resulting force equilibrium within the assembly based on the updated model, wherein the resulting force equilibrium is determined with the displacement removed from the updated model.

A non-transitory computer-readable storage medium instructions that, when executed by a processing system, cause the processing system to execute steps for determining mechanical properties of an assembly, the steps comprising:

• receiving an input specification for a model of the assembly, wherein the input specification includes a compressible body and a surrounding component in the assembly;
• identifying a geometric interference in the model as an overlap between the compressible body and the surrounding component;
• generating a displacement for the compressible body to account for the geometric interference;
• updating the model with the displacement;
• and
• determining a resulting force equilibrium within the assembly based on the updated model, wherein the resulting force equilibrium is determined the displacement removed from the updated model.