Method for curing adhesive composition and method for manufacturing bonded structure
AssigneeOMRON Corporation
InventorsTakekazu Komori, Daisuke Sato, Kyoji Kitamura, Yosuke Tatsuno, Yuki Hoga
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AssigneeOMRON Corporation
InventorsTakekazu Komori, Daisuke Sato, Kyoji Kitamura, Yosuke Tatsuno, Yuki Hoga
Estimating the term…
A method for curing an adhesive composition includes: arranging an adhesive composition that transmits laser light of a first wavelength in contact with a surface of a first adherend that contains, at least at its surface, a first light-to-heat conversion material that generates heat by absorbing laser light of the first wavelength; and curing the adhesive composition by irradiating the adhesive composition and the first adherend with laser light of the first wavelength. In a method for manufacturing a bonded structure, a first bonded structure is manufactured by bonding the adhesive composition to the first adherend by using the method for curing an adhesive composition.
A method for curing an adhesive composition, comprising:
Dependencies are inferred from the claim text.