Encapsulating composition

An organic electronic device, comprising:

• a substrate;
• an organic electronic element formed on the substrate;
• and
• an organic layer sealing the entire surface of the organic electronic element and comprising an encapsulating composition that comprises:
• an epoxy compound comprising:
• an alicyclic epoxy compound;
• and
• a linear or branched aliphatic epoxy compound having at least bifunctionality or more selected from among 1,4-butanediol diglycidyl ether, ethylene glycol diglycidyl ether, 1,6-hexanediol diglycidyl ether, propylene glycol diglycidyl ether, diethylene glycol diglycidyl ether, and neopentyl glycol diglycidyl ether, wherein the linear or branched aliphatic epoxy compound having at least bifunctionality or more is present in an amount of 20 to 60 parts by weight or 173 to 205 parts by weight relative to 100 parts by weight of the alicyclic epoxy compound;
• a compound having an oxetane group and a boiling point in a range of 110 to 300° C. present in an amount of 45 parts by weight to 145 parts by weight relative to 100 parts by weight of the total epoxy compounds present in the composition;
• a surfactant comprising a fluorine-based compound having a polar functional group which is present at the end of the surfactant, wherein the polar functional group is a carboxyl group, a hydroxyl group, a phosphate, an ammonium salt, a carboxylate group, a sulfate, or a sulfonate;
• and
• a photoinitiator comprising an iodonium salt,
• wherein the composition has a viscosity of 50 cP or less, as measured at a temperature of 25° C., a torque of 90% and a shear rate of 100 rpm.