Resistive random access memory and method of fabricating the same
AssigneeWinbond Electronics Corp.
InventorsPo-Yen Hsu, Bo-Lun Wu, Shih-Ning Tsai
Life of this patent
Estimating the term…
Loading patent…
AssigneeWinbond Electronics Corp.
InventorsPo-Yen Hsu, Bo-Lun Wu, Shih-Ning Tsai
Estimating the term…
Provided is a resistive random access memory (RRAM) including a first electrode layer and a second electrode layer disposed opposite to each other, a variable resistance layer located between the first electrode layer and the second electrode layer, an oxygen exchange layer located between the variable resistance layer and the second electrode layer, a conductive layer laterally surrounding a sidewall of the oxygen exchange layer, a first barrier layer located between the conductive layer and the oxygen exchange layer and between the oxygen exchange layer and the variable resistance layer, and a second barrier layer located between the conductive layer and the second electrode layer and between the second electrode layer and the oxygen exchange layer.
A resistive random access memory, comprising:
A method of fabricating a resistive random access memory, comprising:
Dependencies are inferred from the claim text.