Organic light emitting component, fabrication method, and display device each having anti-shrinkage stop structures

A display device, comprising an organic light emitting component, the organic light emitting component comprising:

• a substrate comprising a first surface;
• an intermediate structure layer disposed on the first surface of the substrate, wherein the intermediate structure layer comprises a display area and a non-display area at a periphery of the display area, the display area is provided with a display structure portion, the non-display area is provided with one or more first structures, the intermediate structure layer further comprises a planarization layer, the one or more first structures and the display structure portion are both disposed on the planarization layer and spaced apart from each other;
• and
• a thin film encapsulation structure layer located on a surface of the intermediate structure layer facing away from the substrate, wherein the one or more first structures are disposed between the thin film encapsulation structure layer and the planarization layer, and a free end of the one or more first structures extends into the thin film encapsulation structure layer, wherein the thin film encapsulation structure layer comprises a second inorganic structure layer and an organic structure layer which are sequentially stacked, and the organic structure layer is on the intermediate structure layer,
• wherein the display structure portion comprises a pixel defining layer, an organic light emitting layer, a cathode layer and a first inorganic structure layer;
• the pixel defining layer, the organic light emitting layer, the cathode layer and the first inorganic structure layer are sequentially stacked;
• the pixel defining layer is disposed on the planarization layer;
• and the organic light emitting layer is disposed on a surface of the pixel defining layer facing away from the planarization layer;
• the non-display area is provided with a second structure, the second structure surrounds the one or more first structures, and an outer edge of the thin film encapsulation structure layer extends to the second structure;
• and
• the one or more first structures and the second structure are formed at a same layer as a layer where the pixel defining layer is disposed;
• wherein the one or more first structures and the pixel defining layer are out of contact;
• wherein the free end of the one or more first structures extends into the organic structure layer.

A method for fabricating an organic light emitting component, comprising:

• providing a substrate comprising a first surface;
• disposing an intermediate structure layer on the first surface of the substrate, wherein the intermediate structure layer comprises a display area and a non-display area at a periphery of the display area, the display area is provided with a display structure portion, the non-display area is provided with one or more first structures, the intermediate structure layer further comprises a planarization layer, and the one or more first structures and the display structure portion are both disposed on the planarization layer and spaced apart from each other;
• and
• providing a thin film encapsulation structure layer located on a surface of the intermediate structure layer facing away from the substrate, wherein the one or more first structures are disposed between the thin film encapsulation structure layer and the planarization layer, and a free end of the one or more first structures extends into the thin film encapsulation structure layer, wherein the thin film encapsulation structure layer comprises a second inorganic structure layer and an organic structure layer which are sequentially stacked, and the organic structure layer is on the intermediate structure layer,
• wherein the display structure portion comprises a pixel defining layer, an organic light emitting layer, a cathode layer and a first inorganic structure layer;
• the pixel defining layer, the organic light emitting layer, the cathode layer and the first inorganic structure layer are sequentially stacked;
• the pixel defining layer is disposed on the planarization layer;
• and the organic light emitting layer is disposed on a surface of the pixel defining layer facing away from the planarization layer;
• the non-display area is provided with a second structure, the second structure surrounds the one or more first structures, and an outer edge of the thin film encapsulation structure layer extends to the second structure;
• and
• the one or more first structures and the second structure are formed at a same layer as a layer where the pixel defining layer is disposed;
• wherein the one or more first structures and the pixel defining layer are out of contact;
• wherein the free end of the one or more first structures extends into the organic structure layer;
• the method for fabricating the organic light emitting component further comprising:
• forming the planarization layer on the substrate;
• forming the display structure portion and the one or more first structures at the periphery of the display structure portion with an interval on the planarization layer;
• and
• forming the thin film encapsulation structure layer on the display structure portion and the one or more first structures.