Semiconductor device
AssigneesSemiconductor Manufacturing International (Shanghai) Corporation, Semiconductor Manufacturing International (Beijing) Corporation
InventorFei Zhou
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AssigneesSemiconductor Manufacturing International (Shanghai) Corporation, Semiconductor Manufacturing International (Beijing) Corporation
InventorFei Zhou
Estimating the term…
Semiconductor device is provided. The semiconductor device includes a base substrate including a first region, a second region, and a third region, a first doped layer in the base substrate at the first region and a second doped layer in the base substrate at the third region, a first gate structure on the base substrate at the second region, a first dielectric layer on the base substrate, a first conductive layer on the first conductive layer and the second doped layer, a second conductive layer on a surface of the first conductive layer, and a third conductive layer on a contact region of the first gate structure. The second region is between the first region and the third region. The contact region is at a top of the first gate structure. A minimum distance between the second conductive layer and the third conductive layer is greater than zero.
A semiconductor device, comprising:
Dependencies are inferred from the claim text.