Apparatus, method and recording medium storing command for determining mounting information

A method, comprising:

• acquiring, by one or more processors, solder measurement information indicating a state of a solder printed on a first substrate from a solder measurement device by controlling a communication circuit;
• determining, by the one or more processors, whether or not the state of the solder is changed from states of solders printed on second substrates, which are measured prior to solder measurement of the first substrate, based on the solder measurement information;
• upon the determination that the state of the solder is not changed, determining, by the one or more processors, mounting information indicating a mounting condition for mounting a first component on the first substrate using one or more models stored in one or more memories;
• and
• delivering, by the one or more processors, the mounting information to a mounter, which mounts the first component on the first substrate on which the solder is printed by controlling the communication circuit,
• wherein the one or more models are configured to output the mounting information for the first substrate based on a correlation between states of a second component before and after a reflow process for each of the second substrates.

A non-transitory computer-readable recording medium that stores commands for causing one or more processors to perform an operation when executed by the one or more processors, wherein the commands cause the one or more processors to:

• acquire solder measurement information indicating a state of a solder printed on a first substrate from a solder measurement device by controlling a communication circuit;
• determine whether or not the state of the solder is changed from states of solders printed on second substrates, which are measured prior to solder measurement of the first substrate, based on the solder measurement information;
• upon the determination that the state of the solder is not changed, determine mounting information indicating a mounting condition for mounting a first component on the first substrate using one or more models;
• and
• deliver the mounting information to a mounter, which mounts the first component on the first substrate on which the solder is printed by controlling the communication circuit, and
• wherein the one or more models are configured to output the mounting information for the first substrate based on a correlation between states of a second component before and after a reflow process for each of the second substrates.