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US 11,770,916 B2Granted
Apparatus for an inductor disposed in a band for method of heat dispersion
AssigneeModular Power Technoogy, Inc.
InventorsDhammika L. Perera, John Weld, Matthew Wilkowski
Life of this patent
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Abstract
Embodiments of the present disclosure include an apparatus having a band including a high thermally conductive material is disposed at least partially around an inductor.
Claims13
An apparatus comprising:
- a band comprising a high thermally conductive material disposed at least partially around an inductor, wherein the high thermal conductive material has a thermal conductive value greater than the thermal conductivity of the inductor, wherein a minimum width of the band is the minimum width to allow a thermal connection with one or more terminals of an integrated circuit die.
Dependencies are inferred from the claim text.