Cooling device and method of manufacturing the same
AssigneeAptiv Technologies AG
InventorsFrank H. Adam, Klaus Kaufmann
Life of this patent
Estimating the term…
Abstract
A cooling device for cooling electronic components mounted on a circuit board. The device comprises a hollow body defining a coolant transport circuit for circulating coolant fluid there thorough. The hollow body comprises a plurality of flattened regions linked by duct regions, wherein the flattened regions and duct regions are formed as continuous regions of the body. When the body is secured to the circuit board, each flattened region is configured to align with one or more electronic components for transferring heat away.
Claims20
A cooling device for cooling electronic components mounted on a circuit board, the circuit board also comprising passive components, the device comprising:
- a hollow body defining a coolant transport circuit for circulating coolant fluid therethrough,
- the hollow body comprising a plurality of flattened regions linked by duct regions,
- the flattened regions and duct regions forming continuous regions of the hollow body, one or more flattened regions of the flattened regions having substantially the same cross-sectional area as one or more duct regions of the duct regions, and
- each flattened region being configured to align with one or more electronic components on the circuit board for transferring heat away from the one or more electronic components when the hollow body is secured adjacent to the circuit board while leaving the passive components exposed when the hollow body is secured adjacent to the circuit board.
A method of forming a cooling device for cooling electronic components mounted on a circuit board, the circuit board also comprising passive components, the method comprising:
- providing a blank;
- and
- pressing the blank in a die to form a hollow body having a plurality of flattened regions linked by duct regions, wherein
- the flattened regions and duct regions are formed as continuous regions of the hollow body, one or more flattened regions of the flattened regions having substantially the same cross-sectional area as one or more duct regions of the duct regions,
- the hollow body defines a coolant transport circuit for circulating coolant fluid therethrough, and
- each flattened region is configured to align with one or more electronic components on the circuit board when the hollow body is secured adjacent to the circuit board for transferring heat away from the one or more electronic components while leaving the passive components exposed when the hollow body is secured adjacent to the circuit board.
A system comprising:
- a circuit board;
- one or more electronic components mounted to the circuit board;
- one or more passive components mounted to the circuit board;
- and
- a cooling device configured to cool the one or more electronic components, the cooling device comprising:
- a hollow body defining a coolant transport circuit for circulating coolant fluid through the coolant transport circuit,
- a plurality of flattened regions of the hollow body that are linked by duct regions of the hollow body to form continuous regions of the hollow body, one or more flattened regions of the flattened regions having substantially the same cross-sectional area as one or more duct regions of the duct regions, each flattened region being configured to align with the one or more electronic components on the circuit board for transferring heat away from the one or more electronic components when the hollow body is secured adjacent to the circuit board while leaving the passive components exposed when the hollow body is secured adjacent to the circuit board.
Dependencies are inferred from the claim text.