Heat-dissipating component for mobile device

A heat-dissipating component for a mobile device, comprising:

• a case body having a vent hole and a positioning accommodation trough, wherein the positioning accommodation trough corresponds to the vent hole, and a bottom of the positioning accommodation trough is in communication with the vent hole;
• a micro pump disposed in the positioning accommodation trough, wherein the micro pump corresponds to the vent hole in communication with the bottom of the positioning accommodation trough, whereby gas transmitted by the micro pump is discharged out through the vent hole during operation;
• and
• a heat dissipation tube plate having cooling fluid inside, wherein one end of the heat dissipation tube plate is fixed on the positioning accommodation trough and contacts a heating element of the mobile device so as to perform liquid convective heat exchange with heat generated by the heating element;
• wherein the gas transmitted by the micro pump forms gas flow so as to perform heat exchange with heat absorbed by the heat dissipation tube plate, and the gas flow is discharged out through the vent hole;
• and
• wherein the heat-dissipating component further comprises a liquid pump, wherein the liquid pump is in communication with an inside of the heat dissipation tube plate, whereby the cooling fluid inside the heat dissipation tube plate is capable of being pumped and circulating so that heat exchange effect of the heat dissipation tube plate is accelerated.