3D-printed ceramics with conductor infusion for ultra-high-speed electronics
AssigneeSchlumberger Technology Corporation
InventorsJohn Michael Beshears, Steven O. Dunford
Life of this patent
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Abstract
The disclosure provides for methods of making electrically conductive apparatus, such as circuit boards. The methods include 3D-printing a ceramic material into a ceramic substrate that includes a void. A conductive material is infused into the void. The conductive materiel forms electrically conductive connections within the apparatus. Also disclosed are apparatus formed by the methods.
Claims25
A circuit board, the circuit board comprising:
- a ceramic substrate, the ceramic substrate including a plurality of voids;
- and
- an electrically conductive material within the plurality of voids, wherein the electrically conductive material defines an electrically conductive wiring assembly of the circuit board, the electrically conductive wiring assembly comprising a via, and wherein the circuit board lacks capture pads, wherein the circuit board comprises a first electrical component positioned on a first surface of the circuit board and a second electrical component positioned on a second surface of the circuit board, wherein the first and second surfaces are different surfaces of the circuit board, and wherein the first and second electrical components are electrically coupled through the electrically conductive wiring assembly.
A method of making an electrically conductive apparatus, the method comprising:
- 3D-printing a ceramic material into a ceramic substrate, the ceramic substrate including a void;
- infusing a material into the void;
- retrieving the ceramic substrate with the material within the void, wherein the material is electrically conductive;
- and
- after infusing the material into the void, removing air pockets from the void, removing contaminants from the void, or combinations thereof, wherein the removing includes agitating the ceramic substrate, applying a vacuum to the ceramic substrate, or applying positive pressure to the ceramic substrate.
A method of making an electrically conductive apparatus, the method comprising:
- 3D-printing a first ceramic material into a first portion of a ceramic substrate, the first portion of the ceramic substrate including a first void;
- infusing a first material into the first void;
- prior to infusing the material into the first void, applying a surface treatment to the first portion of the ceramic substrate;
- forming a second portion of the ceramic substrate by 3D-printing a second ceramic material onto the first portion of the ceramic substrate, the second portion of the ceramic substrate including a second void;
- infusing a second material into the second void;
- prior to infusing the material into the second void, applying a surface treatment to the second portion of the ceramic substrate;
- retrieving the ceramic substrate with the first and second material within the first and second voids, wherein the first and second materials are electrically conductive materials, and wherein the surface treatment comprises applying a precursor to the ceramic substrate that encourages wicking of the material along a surface of the ceramic substrate, applying a substance to the ceramic substrate that promotes adherence of the material to the ceramic substrate, applying a resist to the ceramic substrate that resists adherence of the material onto the ceramic substrate, or combinations thereof.
Dependencies are inferred from the claim text.