Method, system and device for manufacturing printed circuit board, and computer storage medium

A device for manufacturing a Printed Circuit Board (PCB), comprising:

• a memory, configured to store a computer program;
• and
• a processor, configured to execute the computer program, wherein upon execution of the computer program, the processor is configured to perform operations comprising:
• acquiring a PCB to be manufactured comprising a via;
• acquiring shape information of the via;
• acquiring connection information of each circuit layer in the PCB to be manufactured;
• assembling preset conducting devices according to the connection information and the shape information, and obtaining a target conducting device matched with the connection information and the shape information;
• guiding the target conducting device into the via, and obtaining a conducting PCB;
• connecting the conducting PCB, and obtaining a target PCB,
• wherein the preset conducting device comprises one or more of a metal conducting device, a nonmetal conducting device, or a semi-metal conducting device;
• wherein the assembling preset conducting devices according to the connection information and the shape information and obtaining a target conducting device matched with the connection information and the shape information comprises:
• determining, based on the connection information, an adjacent first circuit layer and second circuit layer to be connected in the circuit layers of the PCB to be manufactured;
• determining an intermediate circuit layer between the first circuit layer and the second circuit layer based on distribution positions of the circuit layers of the PCB to be manufactured;
• setting conducting devices corresponding to the first circuit layer, the second circuit layer, and the intermediate circuit layer as metal conducting devices or semi-metal conducting devices;
• setting a conducting device corresponding to another circuit layer except the first circuit layer, the second circuit layer, and the intermediate circuit layer as a nonmetal conducting device;
• setting shapes of the conducting devices corresponding to the circuit layers of the PCB to be manufactured according to the shape information;
• and
• assembling the conducting devices corresponding to the circuit layers of the PCB to be manufactured according to the distribution positions of the circuit layers of the PCB to be manufactured, and obtaining the target conducting device.

A non-transitory computer-readable storage medium, storing a computer program which is executed by a processor, wherein upon execution of the computer program, the processor is configured to perform operations comprising:

• acquiring a Printed Circuit Board (PCB) to be manufactured comprising a via;
• acquiring shape information of the via;
• acquiring connection information of each circuit layer in the PCB to be manufactured;
• assembling preset conducting devices according to the connection information and the shape information, and obtaining a target conducting device matched with the connection information and the shape information;
• guiding the target conducting device into the via, and obtaining a conducting PCB;
• connecting the conducting PCB, and obtaining a target PCB,
• wherein the preset conducting device comprises one or more of a metal conducting device, a nonmetal conducting device, or a semi-metal conducting device;
• wherein the assembling preset conducting devices according to the connection information and the shape information and obtaining a target conducting device matched with the connection information and the shape information comprises:
• determining, based on the connection information, an adjacent first circuit layer and second circuit layer to be connected in the circuit layers of the PCB to be manufactured;
• determining an intermediate circuit layer between the first circuit layer and the second circuit layer based on distribution positions of the circuit layers of the PCB to be manufactured;
• setting conducting devices corresponding to the first circuit layer, the second circuit layer, and the intermediate circuit layer as metal conducting devices or semi-metal conducting devices;
• setting a conducting device corresponding to another circuit layer except the first circuit layer, the second circuit layer, and the intermediate circuit layer as a nonmetal conducting device;
• setting shapes of the conducting devices corresponding to the circuit layers of the PCB to be manufactured according to the shape information;
• and
• assembling the conducting devices corresponding to the circuit layers of the PCB to be manufactured according to the distribution positions of the circuit layers of the PCB to be manufactured, and obtaining the target conducting device.