Surface-treated copper foil, and copper-clad laminate plate, resin-attached copper foil and circuit board each using same
AssigneesPanasonic Intellectual Property Management Co., Ltd., Fukuda Metal Foil & Powder Co., Ltd.
InventorsYuki Kitai, Takeshi Okamoto
Life of this patent
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Abstract
A surface treated copper foil includes: a copper foil; a finely roughened particle treatment layer of copper on at least one surface of the copper foil, the finely roughened particle treatment layer including fine copper particles having a particle size of 40 to 200 nm; a heat resistance treatment layer containing nickel on the finely roughened particle treatment layer; a rust prevention treatment layer containing at least chromium on the heat resistance treatment layer; and a silane coupling agent treatment layer on the rust prevention treatment layer. An amount of nickel attached in the heat resistance treatment layer is 30 to 60 mg/m2.
Claims5
A surface treated copper foil comprising:
- a copper foil;
- a finely roughened particle treatment layer of copper on at least one surface of the copper foil, the finely roughened particle treatment layer including fine copper particles having a particle size of 40 to 200 nm;
- a heat resistance treatment layer containing nickel on the finely roughened particle treatment layer;
- a rust prevention treatment layer containing at least chromium on the heat resistance treatment layer;
- and
- a silane coupling agent treatment layer on the rust prevention treatment layer, wherein
- an amount of nickel attached in the heat resistance treatment layer is 30 to 60 mg/m2, and
- the heat resistance treatment layer is composed of nickel, or nickel and phosphorus.
Dependencies are inferred from the claim text.