Electronic board having components in cavities and shared solder pads and manufacturing method for the same

An electronic circuit board comprising:

• a printed circuit board comprising a first insulating layer, a second insulating layer attached to the first insulating layer and in which is form an open cavity, and at least a second conductive layer attached to the second insulating layer, wherein the second conductive layer is treated such as form a surface solder pad;
• and
• a first electronic component and a second electronic component;
• wherein the first electronic component is housed in the open cavity of the second insulating layer;
• wherein the second electronic component is placed on the second insulating layer without overlapping with the open cavity;
• and
• wherein the first electronic component and the second electronic component each comprises a termination soldered on the surface solder pad, the surface solder pad being shared by the first electronic component and the second electronic component;
• wherein a single solder joint directly contacts the termination of the first electronic component, the termination of the second electronic component, and the surface solder pad.