Substrate structure and electronic device including the same

An electronic device comprising:

• a mainboard;
• a first printed circuit board disposed on the mainboard;
• a semiconductor chip disposed on one side of the first printed circuit board;
• and
• a plurality of passive components disposed on another side of the first printed circuit board,
• wherein the plurality of passive components include a first group, including a plurality of first passive components, and a second group, including a plurality of second passive components,
• the semiconductor chip includes a first functional circuit and a second functional circuit disposed adjacent to each other on a plane,
• at least a portion of the first group overlaps the first functional circuit, when viewed from above, and at least a portion of the second group overlaps the second functional circuit, when viewed from above,
• the plurality of passive components further includes a third group including a plurality of third passive components,
• the semiconductor chip further includes a third functional circuit and a fourth functional circuit,
• at least a portion of the third group overlaps the third functional circuit, when viewed from above,
• each of the third and fourth functional circuits includes an input/output unit (IOU), and
• the third functional circuit has a larger planar area than the fourth functional circuit.

A printed circuit board having first and second surfaces opposing each other in a first direction, and configured for having a semiconductor chip, having first and second functional circuits disposed adjacent to each other on a plane, mounted on the second surface, the printed circuit board comprising:

• a planar insulating layer;
• first and second passivation layers each disposed between the planar insulating layer and a respective one of the first and second surfaces, and each having openings exposing pads through the respective one of the first or second surface;
• a plurality of passive components disposed on the first surface of the printed circuit board and connected to a plurality of pads exposed through the first surface;
• and
• connection metals, each having a lower melting point than copper (Cu), disposed on the pads in the openings of the first and second passivation layers on the first and second surfaces of the printed circuit board,
• wherein a first passive component of the plurality of passive components is disposed in an area overlapped in the first direction by the first functional circuit of the semiconductor chip, and a second passive component of the plurality of passive components is spaced apart from the first passive component and is disposed in an area overlapped in the first direction by the second functional circuit of the semiconductor chip, and
• the connection metals on the first surface extend to a greater distance from the first surface in the first direction than the passive components of the plurality of passive components.