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US 11,770,894 B2Granted
Printed circuit board
AssigneeSamsung Electro-Mechanics Co., Ltd.
InventorHiroki Okada
Life of this patent
Estimating the term…
Abstract
A printed circuit board includes a rigid region and a flexible region; a first substrate disposed on the rigid region and the flexible region and comprising a first insulating layer and a first wiring layer comprising a first groove in the flexible region; and a second substrate disposed on the first substrate in the rigid region and comprising a first adhesive layer, a second insulating layer and a second wiring layer.
Claims20
A printed circuit board, comprising:
- a rigid region and a flexible region;
- a first substrate disposed on the rigid region and the flexible region, the first substrate comprising a first insulating layer comprising a first groove in the flexible region, and a first wiring layer;
- and
- a second substrate disposed on the first substrate in the rigid region and comprising a first adhesive layer, a second insulating layer and a second wiring layer.
1 more element
A printed circuit board, comprising:
- a first insulating layer including a first groove;
- a first wiring layer disposed on the first insulating layer, and including a pattern disposed on one side of the first groove;
- a second insulating layer disposed on the one side of the first groove to cover the pattern;
- a third insulating layer disposed on the second insulating layer;
- and
- a second wiring layer disposed on the third insulating layer and connected to the first wiring layer,
- wherein a portion of the first insulating layer disposed on another side of the groove is exposed from the second insulating layer and the third insulating layer, and
- a material included the second insulating layer extends from the second insulating layer to be disposed in at least a portion of the first groove.
5 more elements
Dependencies are inferred from the claim text.