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US 11,770,153 B2Granted
Radio-frequency module
AssigneeMurata Manufacturing Co., Ltd.
InventorMasashi Hayakawa
Life of this patent
Estimating the term…
Abstract
A radio-frequency module includes a substrate and a switch IC mounted on the substrate and including a common terminal and a plurality of selection terminals. The substrate includes ground electrodes disposed between the common terminal and the plurality of selection terminals in a plan view of the substrate.
Claims19
A radio-frequency module comprising:
- a substrate including a first main surface, a second main surface opposed to the first main surface, and a plurality of layers stacked on each other between the first main surface and the second main surface;
- and
- a circuit component mounted on the substrate, the circuit component including a first switch and a plurality of bumps disposed on the first main surface of the substrate;
- wherein
- the plurality of bumps include:
- a first bump defining a common terminal of the first switch;
- a second bump defining a first selection terminal of the first switch;
- and
- a third bump defining a second selection terminal of the first switch;
- the first selection terminal and the common terminal are connectable with each other through the first switch;
- the second selection terminal and the common terminal are connectable with each other through the first switch;
- the multilayer substrate further includes a first ground electrode;
- the first ground electrode is disposed between the common terminal and the first selection terminal and/or is disposed between the common terminal and the second selection terminal in a plan view of the substrate;
- and
- the first ground electrode is not exposed from the first main surface of the substrate.
12 more elements
A radio-frequency module comprising:
- a substrate including a first main surface, a second main surface opposed to the first main surface, and a plurality of layers stacked on each other between the first main surface and the second main surface;
- and
- a circuit component mounted on the substrate, the circuit component including a first switch and a plurality of bumps on the first main surface of the substrate;
- wherein
- the plurality of bumps include:
- a first bump defining a common terminal of the first switch;
- a second bump defining a first selection terminal of the first switch;
- and
- a third bump defining a second selection terminal of the first switch;
- the first selection terminal and the common terminal are connectable with each other through the first switch;
- the second selection terminal and the common terminal are connectable with each other through the first switch;
- the multilayer substrate further includes a first ground electrode, a second ground electrode, and a wiring pattern connecting the first ground electrode and the second ground electrode;
- at least a portion of the wiring pattern is disposed between the common terminal and the first selection terminal and/or is disposed between the common terminal and the second selection terminal in a plan view of the substrate;
- and
- at least one of the first ground electrode and the second ground electrode is not exposed from the first main surface of the substrate.
12 more elements
Dependencies are inferred from the claim text.