Method of cutting a substrate along dividing lines

A method of manufacturing a light emitting element, the method comprising:

• scanning and irradiating a laser light having a first irradiation intensity to a sapphire substrate along predetermined dividing lines collectively in a shape of a tessellation of a plurality of hexagonal shapes in a top view to create a plurality of first modified regions along the predetermined dividing lines;
• and
• scanning and irradiating a laser light having a second irradiation intensity greater than the first irradiation intensity to the sapphire substrate along the predetermined dividing lines to create a plurality of second modified regions overlapping the plurality of first modified regions;
• wherein the step of creating first modified regions comprises:
• a step of first irradiating a laser light successively to all of the predetermined dividing lines extending in a first direction in parallel to first opposite sides which are opposite sides of each of the plurality of hexagonal shapes;
• a step of second irradiating a laser light successively to all of the predetermined dividing lines extending in a second direction in parallel to second opposite sides which are opposite sides different from the first opposite sides of each of the plurality of hexagonal shapes;
• and
• a step of third irradiating a laser light successively to all of the predetermined dividing lines extending in a third direction in parallel to third opposite sides which are opposite sides different from the first opposite sides and the second opposite sides of each of the plurality of hexagonal shapes, and
• wherein the step of first irradiating a laser light comprises:
• a step of first scanning and irradiating in which a laser light is caused to scan along the first direction and irradiated to a plurality of segments of first predetermined dividing lines located on a single straight line extending in the first direction;
• and
• a first repeating step in which a target position of the laser light is parallelly shifted by half a distance between the first opposite sides and repeats the first scanning and irradiating;
• the step of second irradiating a laser light comprises:
• a step of second scanning and irradiating in which a laser light is caused to scan along the second direction and irradiated to a plurality of segments of second predetermined dividing lines located on a single straight line extending in the second direction;
• and
• a second repeating step in which a target position of the laser light is parallelly shifted by half a distance between the second opposite sides and repeats the second scanning and irradiating;
• and
• the step of third irradiating a laser light comprises:
• a step of third scanning and irradiating in which a laser light is caused to scan along the third direction and irradiated to a plurality of segments of third predetermined dividing lines located on a single straight line extending in the third direction;
• and
• a third repeating step in which a target position of the laser light is parallelly shifted by half a distance between the third opposite sides and repeats the third scanning and irradiating.