Photonic integrated module with metal embedded chips
AssigneeHRL Laboratories, LLC
InventorsDaniel Yap, Florian G. Herrault, Christopher S. Roper, Partia Naghibi
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Abstract
A photonic module and a method of making same, the module having one or more optoelectronic chips, such as a laser diode typically having six sides, with each optoelectronic chip having two opposing sides (a first side and a second side) abutting and electrically connected to metal regions (preferably electro-formed), the two metal regions are physically distinct and electrically separate from each other, the two electro-formed metal regions serving, in use, as heat spreaders for conducting heat away from the optoelectronic chip.
Claims17
A photonic module comprising one or more optoelectronic chips, with each optoelectronic chip having an epi-layer side and a substrate side, joined by at least one light coupling side, wherein the epi-layer side and the substrate side are each abutting and electrically connected to one of a first and second metal regions, the first and second metal regions being physically distinct and electrically separate from each other, the first and second metal regions serving, in use, as heat spreaders for conducting heat away from the optoelectronic chip.
A photonic module comprising a plurality of optoelectronic chips, with at least a majority of said optoelectronic chips having each an epi-layer side and a substrate side, joined by at least one light coupling side, wherein the epi-layer side and the substrate side are each abutting and electrically connected to first and second metal regions, the first and second metal regions being physically distinct and electrically separate from each other, the metal regions serving, in use, as heat spreaders for conducting heat away from the plurality of optoelectronic chips.
Dependencies are inferred from the claim text.