Back to results
US 11,769,793 B2Granted
Metal-insulator-metal (MIM) capacitor module
AssigneeMicrochip Technology Incorporated
InventorYaojian Leng
Life of this patent
Estimating the term…
Abstract
A metal-insulator-metal (MIM) capacitor module is provided. The MIM capacitor module includes a bottom electrode base formed in a lower metal layer, a bottom electrode conductively coupled to the bottom electrode base, a planar insulator formed over the bottom electrode, and a top electrode formed in an upper metal layer over the insulator. The bottom electrode includes a cup-shaped bottom electrode component and a bottom electrode fill component formed in an interior opening defined by the cup-shaped bottom electrode component.
Claims14
A device, comprising:
- a metal-insulator-metal capacitor module, comprising:
- a bottom electrode base formed in a lower metal layer;
- a bottom electrode formed in a dielectric region and conductively coupled to the bottom electrode base and comprising:
- a cup-shaped bottom electrode component formed in a bottom electrode opening in the dielectric region and;
- and
- a bottom electrode fill component formed in an interior opening defined by the cup-shaped bottom electrode component;
- a planar insulator formed over the bottom electrode;
- a bottom electrode contact formed in a bottom electrode contact opening in the dielectric region, the bottom electrode contact opening laterally spaced apart from the bottom electrode opening;
- a top electrode formed in an upper metal layer over the planar insulator;
- and
- a bottom electrode connection element formed in the upper metal layer, the bottom electrode connection element conductively connected to the bottom electrode base through the bottom electrode contact;
- wherein the cup-shaped bottom electrode component and the bottom electrode contact are formed from a conformal metal layer;
- wherein the bottom electrode fill component is formed from a fill metal layer;
- and
- wherein the bottom electrode opening is partially filled by the conformal metal layer and partially filled by the fill metal layer;
- and
- wherein the bottom electrode contact opening is filled by the conformal metal layer and is free of the fill metal layer.
14 more elements
A device, comprising:
- an interconnect structure comprising:
- a lower interconnect element formed in a lower metal layer;
- an upper interconnect element formed in a upper metal layer;
- and
- an interconnect via conductively connected between the lower interconnect element and the upper interconnect element;
- a metal-insulator-metal capacitor module separate from the interconnect structure, the metal-insulator-metal capacitor module comprising:
- a bottom electrode base formed in the lower metal layer;
- a bottom electrode conductively coupled to the bottom electrode base and comprising:
- a cup-shaped bottom electrode component;
- and
- a bottom electrode fill component formed in an interior opening defined by the cup-shaped bottom electrode component;
- a planar insulator formed over the bottom electrode;
- a top electrode formed in the upper metal layer;
- wherein the cup-shaped bottom electrode component and the interconnect via are formed from a conformal metal layer;
- wherein the bottom electrode fill component is formed from a fill metal layer different than the conformal metal layer;
- and
- wherein the interconnect via is free of the fill metal layer.
14 more elements
Dependencies are inferred from the claim text.