Trench capacitor profile to decrease substrate warpage

An integrated circuit (IC) comprising:

• a substrate;
• a plurality of conductive layers overlying the substrate;
• a plurality of dielectric layers overlying the substrate and spaced between the plurality of conductive layers, wherein the plurality of conductive layers and the plurality of dielectric layers define a trench segment extending into the substrate;
• and
• a pillar structure abutting the trench segment, wherein a width of the pillar structure varies from a front-side surface of the substrate in a direction towards a bottom surface of the pillar structure, wherein an outer edge of the pillar structure directly overlies at least a portion of the trench segment.