Imaging device, electronic apparatus, and method of manufacturing imaging device

An electronic apparatus, comprising:

• an imaging device, wherein the imaging device includes:
• a plurality of pixels configured to execute photoelectric conversion of light;
• a first substrate having a pixel region, wherein the pixel region includes the plurality of pixels in a two-dimensional arrangement;
• a second substrate;
• a through silicon via in the second substrate, wherein the through silicon via penetrates the second substrate from a dug portion to a back surface of the first substrate;
• the dug portion in a back surface of the second substrate, wherein
• a side surface of the dug portion has a tapered shape, and
• the back surface of the second substrate is opposite to a light incident side of the second substrate;
• a redistribution layer in the dug portion, wherein
• the redistribution layer is connected to the back surface of the first substrate, and
• the back surface of the first substrate is opposite to a light incident side of the first substrate;
• and
• a solder ball in the dug portion, wherein the solder ball is on the redistribution layer.