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US 11,769,758 B2Granted
Light emitting diode array containing a black matrix and an optical bonding layer and method of making the same
AssigneeNanosys, Inc.
InventorBrian Kim
Life of this patent
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Abstract
A light emitting device includes a backplane, an array of light emitting diodes attached to a front side of the backplane, a transparent conductive layer contacting front side surfaces of the light emitting diodes, an optical bonding layer located over a front side surface of the transparent conductive layer, a transparent cover plate located over a front side surface of the optical bonding layer, and a black matrix layer including an array of openings therethrough, and located between the optical bonding layer and the transparent cover plate.
Claims10
A method of forming a light emitting device, comprising:
- attaching an array of light emitting diodes to a front side of a backplane;
- forming a dielectric matrix layer on the front side of the backplane and around the array of light emitting diodes, a planar top surface of the dielectric matrix layer being coplanar with top surfaces of each of the light emitting diodes;
- forming a transparent conductive layer on front side surfaces of the light emitting diodes and over the dielectric matrix layer;
- disposing a transparent cover plate over a front side of the transparent conductive layer, wherein the transparent cover plate is vertically spaced from the front side of the transparent conductive layer by a gap;
- and
- filling the gap with an optically bonding layer by injecting a transparent dielectric material into the gap.
3 more elements
Dependencies are inferred from the claim text.